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CMP partners with CMC and MOSIS to introduce a 3D-IC process
.jpg&mask=151x112.png "CMP partners with CMC and MOSIS to introduce a 3D-IC process")
A 3D-IC MPW service based on Tezzaron's SuperContact technology and GLOBALFOUNDRIES 130nm CMOS is to be offered by a partnership formed between Grenoble-based broker in ICs and MEMS for prototyping and low volume production, CMP, and CMC Microsystems, a non-profit organization that supports microelectronics and microsystems R&D in Canada, and California-based MOSIS that provides fabrication services to designers of advanced integrated circuits (ICs).
- 2-tier face-to-face bonded wafers
- 130nm CMOS process for both tiers
- Top tier exposing TSV and backside metal pads for wire bonding.
Further MPW runs schedule supporting process flavors (multiple tiers beyond 2, different CMOS flavors for different tiers) will be driven by user's requirements.
Related link:
cmp.imag.fr
www.mosis.com
www.cmc.ca
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The Spartan-6 FPGA embedded kit offered by Xilinx in this month's reader offer is based on the company's Spartan-6 LX45T FPGA. It contains an extensible development board and the key tools and IP needed for embedded development.
The reference designs and software/hardware tutorials provided with this kit will give a jump-start to your development. The package worth 735 Euros includes a ROHS compliant SP605 base board including the XC6SLX45T-FGG484 -3 FPGA, the ISE Design Suite device-locked for the Spartan-6 LX45T FPGA and numerous other tools.
READER OFFER
This month, Xilinx is giving away one such kit, worth 735 Euros, for EETimes Europe's readers to win.
And the winners are...
In our previous reader offer, Cypress was giving away three PsoC3 development boards, worth USD 249 each.
Lucky winners include Mr. M. Casartelli from Italy, Mr J. Pirkin from Belgium and Mr. L. Vagasi from Hungary. All should be receiving their kits soon. Let's wish them some interesting findings with their projects.
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