Developed in partnership with Viosoft Corporation, the Arriba Android Porting Kit (APK) announced by MIPS Technologies will ease the deployment of the Android platform across the MIPS development community.

The base Xtensa LX3 DPU configuration can reach speeds of more than 1 GHz in 45nm process technology (45GS) with an area of 0.037 mm(2) and power of 0.015 mW/MHz.

Conexant Systems has launched an audio system-on-chip (SoC) product line for embedded audio and voice applications.

Murata Power Solutions has expanded the Okami range of non-isolated Point-of-Load (PoL) DC/DC power converters with the addition of 10 A and 16 A models in both surface mount (SMT) and through-hole SIP formats.

TI to combine IDT IP with its latest DSPs for wireless applications.

TI to combine IDT IP with its latest DSPs for wireless applications.

Almost a year has passed since Freescale Semiconductor Inc. unveiled its six-core DSP chip, but not much has been seen about design wins for it. The wait is over. Freescale has achieved a design win with Alcatel-Lucent.

The ConnX D2 core from Tensilica represents a major push by the company into broader communcications processing applications it comes well armed as far as new architectures go, with full C compiler support, including intrinsics for TI's C6x and ITU code.

Tensilica has introduced the high-performance, small, low-power ConnX D2 16-bit dual-MAC (Multiply Accumulator) DSP engine for its proven Xtensa LX dataplane processor cores for SOC (System-on-Chip) designs.

Tensilica has introduced the high-performance, small, low-power ConnX D2 16-bit dual-MAC (Multiply Accumulator) DSP engine for its proven Xtensa LX dataplane processor cores for SOC (System-on-Chip) designs.